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Untitled Document
品名
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用途
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Type
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硬化条件(℃/分)
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TI
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黏 度
(@25℃,cps)
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Tg(℃)
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Filler含量(%)
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曝光时间(hrs)
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备 注
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WE-1010D
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SMD
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Dispense
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150/80
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5.0
|
400
|
105
|
130
|
24
|
.
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WF-1010S
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SMD
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Screen
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150/80
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4.5
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700
|
110
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140
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24
|
.
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WE-1010M
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SMD
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Multy-pin
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150/80
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4.0
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250
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110
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130
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24
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.
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WE-2030
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SMD
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Dispense
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200/120
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4.5
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450
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130
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180
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48
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IC 固定用
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WE-1800
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UV Cure
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1500mj
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2.0
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20
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45
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80
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放于冷暗处保管
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