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Untitled Document
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品名
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用途
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Filler Type
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密度 (g/cc)
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黏度 (@25℃,cps)
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硬化条件 (℃/min.)
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Modulus (MPa)
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黏合力 (Cross-Cut)
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备注
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WE-4401
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Chip黏着
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Silver
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3.5
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7,000
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175/15
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3,500
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80
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速硬化
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WE-4405
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Chip黏着
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Silver
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3.5
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8,000
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175/30
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4,000
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120
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.
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WE-4406
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Chip黏着
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Silver
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3.4
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9,500
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175/60
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2,900
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40
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.
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