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Untitled Document
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品名
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用途
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硬化条件(℃/分)
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流动性
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黏 度
(@25℃,cps)
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Tg(℃)
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Filler含量(%)
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曝光时间(hrs)
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备注
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WE-1007
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CSP/BGA
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120/20 or 150/5
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high
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4,000
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90
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0
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48
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Repaireble
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WF-1008
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CSP/BGA
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120/20 or 150/5
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very high
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3,500
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85
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0
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48
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Repaireble
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WE-1100
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Flip Chip
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150/20
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high
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6,000
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140
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50
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24
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.
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WE-1105
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Flip Chip
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150/10
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very high
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3,500
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135
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25
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48
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.
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WE-1201
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FBGA
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160/60
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midiume
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5,500
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150
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80
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72
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低收缩
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