::: 预烧承座(预烧 socket)(3M) :::

       
       
       
       
 
 
BGA/LGA socket
1) 1.27 mm and 1.50 mm Lidded Sockets.
2) 1.0 mm BGA,Lidded Sockets.
3) 0.65 mm BGA,Open-Top Sockets.
4) 0.80 mm BGA,Open-Top Sockets.
5) 1.0 mm BGA,Open-Top Sockets.
6) 1.27 mm BGA,Open-Top Sockets.

PGA sockets
1)PGA Socket : Test & Burn-in 10x10 thru 25x25.
2)PGA Kit Socket : Pin Grid Arrays 10x10 thru 25x25.
3)IPGA Socket : Test & Burn-in Interstitial 17x17.
4)IPGA Socket : Test & Burn-in Interstitial 23x23.
5)SPGA Socket : Test & Burn-in SPGA 37x37.

ZIP DIP & RECEPTACLE sockets.
1) 0.100" DIP sockets - ZIP DIP.
2) 0.100" DIP sockets - Universal DIP.
3) 0.070" DIP sockets - Shrink DIP.
4) Receptacles for DIP Sockets.

ZIP Strip
1) In-line ZIP Strip Sockets : 2.54mm
2) Axial In-Line ZIP Strip Sockets : 2.54 mm
3) Staggered ZIP Strip Sockets : 1.27 mm x 2.54 mm
4) Axial ZIP Strip Sockets : 1.27 mm x 2.54 mm
5) Staggered ZIP Strip Sockets : 1.27 mm x 2.54 mm

LCC sockets
-Small LCC sockets
-Medium LCC Sockets
-Large LCC Sockets
-Additional LCC Sockets.

PLCC sockets
-Small PLCC Lidded Sockets
-Medium PLCC Lidded Sockets
-Large PLCC Lidded Sockets
-Additional LCC Sockets.

上网进入3M公司的网站(www.mmm.com/ehpd),可以了解到各种产品的详细说明。

 

用于预烧电路板生产、最终实验时使用的 high fix 电路板的制造、ESD stress 电路板生产、以及其他半导体检测。

 
BGA/LGA sockets
PGA sockets
IPGA Sockets
IPGA Sockets
SPGA Sockets
ZIP DIP & RECEPTACLE sockets.
ZIP Strip
LCC Sockets
PLCC sockets